Breakthrough performance, energy efficiency, extended lifecycle support and common socket Intel Xeon processor-based systems make them the ideal choice for compute-intensive embedded, storage and communications applications.

Lower thermal design power (TDP) and higher Tcase temperature Intel Xeon processor options are ideal options for low power consumption and/or compliance with the AdvancedTCA* form factor and NEBS level-3 thermal specifications*.

Platform configurations

These processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms for a wide range of applications. These include storage area networks (SANs), network attached storage (NAS), routers, IP-PBX, converged/unified communications platforms, sophisticated content firewalls, unified threat management (UTM) systems, medical imaging equipment, military signal and image processing, and telecommunications (wireless and wireline) servers.

• Intel® 5000P chipset-based platforms are ideal for full performance and memory-intense applications by providing a maximum FB-DIMM memory capacity of 64 GB, 28 lanes of PCI Express* and accelerated I/O options.
• Intel® 5100 Memory Controller Hub (MCH) chipset-based platforms are ideal for bladed and dense bladed applications requiring less than 200 watts, including AdvancedTCA and NEBS-compliance.